PRODUCTS
ALS Co., Ltd. is building the power to lead with cutting-edge technology.
CP Division
ALS is comprised of the CP Division and the ET Division.
The CP (Copper Plating) Division is engaged in plating (via fill, rigid), which is the core of the electronic components industry.
Copper Plating
Process Overview
Deburring
Desmear
Soft-Etching
Electroless-Processing
Electric-Processing
Products Available
*Production capacity / 103,500m² (based on Electrical Building)
Rigid PCB Flexible PCB Rigid Flexible PCB Package Substrate Metal PCBMajor Clients
Applicable Products
R PCB
Multilayer R PCB
F PCB
Overview
The CP Division receives semi-finished products from PCB manufacturers and uses its core technologies to implement copper plating of uniform thickness within the substrate and processed holes through the processes of ① desmear, ②electroless CU (primary), and ③ electro CU (secondary). ALS has all the know-how for this.
Plating Process Flow
Major Technologies
Desmear
Electroless Cu Plating
Electro Cu Plating
Facilities and Production Capacity
| Category | Factory 1 | Factory 2 | Subtotal for Electro CU Plating | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Soft Etching | Deburrin | Desmear | Electroless CU Plating | Electro CU Plating | Desmear | Electroless CU Plating | Electro CU Plating | ||||
| Via-Fill | General/ Half Fill | General | |||||||||
| Number of Lines (facilities) | 1Line | 2Line | 2Line | 3Line | 4Line | 2Line | 1Line | 1Line | 2Line | 8Line | |
| Capa(㎡/月) | 40,000 | 68,000 | 51,000 | 84,000 | 42,000 | 25,500 | 27,000 | 24,000 | 36,000 | 103,500 | |
| P r o c e s s C a p a b i l i t y |
Board Thickness (T) | 0.15~1.6 | 0.3~2.4 | 0.15~1.6 | 0.15~1.6 | 0.03~1.6 | 0.05~1.6 | 0.06 ~ 1.4 | 0.06 ~ 1.4 | 0.06 ~ 1.4 | 0.03 ~ 1.6 |
| Board Thickness (T) | 250 X 250 535 X 620 |
250 X 250 535 X 620 |
250 X 250 535 X 620 |
250 X 250 535 X 620 |
350 X 400 750 X 505 520 X 650 |
350 X 400 (variable) 520 X 650 (variable) 510 X 410 (fixed) |
500 X 400 530 X 430 |
500 X 400 530 X 430 |
500 X 405 520 X 420 Top/bottom Clamping |
- | |
| Etch Rate(㎛) | 0.8~1.5 | - | 0.7~1.3 | 0.6~1.0 | - | - | 0.7 ~ 1.3 | 0.3 ~ 0.6 | - | - | |
| Plating Thickness (㎛) | 0.4~0.7 | - | - | 0.4~0.7 | 10~25(18) | 10~40(25) | - | 0.6~1.0 | 10 ~ 25 (18) | 10~35 | |
| Plating Deviation(㎛) | ± 0.5 | - | - | - | ± 3 | ± 2 | - | - | ± 1.5 | - | |
| Throwing Power |
- | - | - | - | Dimple 5㎛↓ | LVH 85%↑ | - | - | LVH 85%↑ | - | |
| PTH 70%↑ | PTH 90%↑ | PTH 90%↑ | |||||||||
Process Flow
Mechanismfor Each Process
Desmear
Electroless CU Ion Type
Electro CU General, Half Fill
Via Fill Plating
Via Fill Plating
Products
| Product Group | Product Image | Application | Image |
|---|---|---|---|
| Rigid PCB SSD Module Memory Module (DIMM, SO-DIMM, RDIMM) Mobile, LCD |
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| Rigid Flexible PCB Camera Earbud |
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| Package PCB CSP, BOC, SIP Power Inductor |
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