PRODUCTS

ALS Co., Ltd. is building the power to lead with cutting-edge technology.

ET Division

ALS is comprised of the CP Division and the ET Division.
The ET (Etching) Division is engaged in etching of lead frames and high-tech components.

Etching

Process Overview

Pre-Treatment Exposing Etching

Products Available

*Production capacity: 2,800,000 frames/month

Camera Module Device Wireless Power Charger IC-PKG Leadframe LED Leadframe RIS Antenna

Major Clients

Applicable Products

LED

Lead Frame

WPC

Camera Module

Overview

The Etching Division performs etching processes for manufacturing components such as LEDs, semiconductor lead frames, and heat shields.
Precise implementation of customer-required patterns constitutes our core competitive edge.
The company’s technical capabilities are at the ±5um level for Half Etching depth tolerance, and for Fine Pattern, it is at the level of 5mil 130pitch & 6min 150pitch.

Etching Process Flow

Major Technologies

Artwork (Patterning)

Realize complex, diverse patterns requested by customers in precision

Half Etching

Implement semi-etching by chemical treatment on copper plate for heat shielding plates

R2R

Roll to Roll method

Facilities and Production Capacity

“A leader in R2R Fine Etching of components that meets customer needs”

Pre-treatment :: 2.8 Million Frame / Month / 2 Line

Exposing :: 2.8 Million Frame / Month / 4 Machine

Etching :: 2.8 Million Frame / Month / 2 Line

Major Product Groups (LED & IC Leadframe & ETC)

Process Flow

Pre-Treatment & DFR Lamination

Pre-treatment + DFR Lami

Exposure

Exposing

Develop & Etching

Lead Shape(cross-section)

Stripping & Re-Coiling

Mechanism for Each Process

Mechanism for Each Process
Pre-treatment	Removing oil and impurities	※ It removes impurities through alkaline agents and forms inorganic impurities and surface micro-roughness through strong acids(DFR adhesion increases).
Lamination	Dry film deposition	※ It deposits DFR for exposure on the surface of the raw material using a high-temperature hot roller, and then proceeds with recoiling.
Exposure	Dividing into hardened and uncured parts using a glass mask and light	※ It removes the DFR from the uncured area (part not exposed to light) by using an alkaline chemical to expose the coil.
Developing	Exposing coil through removal of DFR in uncured area	※ It removes the DFR from the uncured area (part not exposed to light) by using an alkaline chemical to expose the coil.
Etching	Etching exposed coil areas	※ It is etchedto the desired thickness by controlling the pressure on the exposed coil areas using an electrophoresis solution.
Stripping	Removing residual DFR so that only coil remains	※ Residual DFR (hardened zone between exposures) s removed using strong alkaline chemicals, ultimately leaving only the coils.
Final post-treatment	Removing oxidation protection layer and chemicals	※ It prevents product oxidation through rust prevention chemicals, and it removes chemicals by forming a protective layer and washing with water.
Recoiler	Winding the completed product onto the bobbin	※ Finished products are wound onto bobbins, transported to the warehouse, and then packaging is carried out.